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The BGA-STD-010 is a 13mm standard Heat Sink with aluminium, black anodized, thermal tape, 27C/W thermal resistance. This heat sink features excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated, on both sides with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heat sink and to metal enclosure surfaces.
HVAC
| External Diameter – Metric | – |
| Packages Cooled | BGA |
| Heat Sink Material | Aluminium |
| Thermal Resistance | 27C/W |
| External Length – Imperial | 0.512″ |
| External Length – Metric | 13mm |
| External Width – Metric | 13.5mm |
| External Diameter – Imperial | – |
| External Height – Metric | 10mm |
| External Height – Imperial | 0.394″ |
| External Width – Imperial | 0.531″ |
| Product Range | – |
| Brand | ABL HEATSINKS |
| Part Number | BGA-STD-010 |
| Quantity | Each |
| Technical Data Sheet EN |
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