Product Overview

AS4C256M16D3LC-10BCN is a 256M x 16-bit DDR3L synchronous DRAM (SDRAM). The 4Gb double-data-rate-3 (DDR3L) DRAM is a double data rate architecture to achieve high-speed operation. It is internally configured as an eight-bank DRAM. The 4Gb chip is organized as 32Mbit x 16 I/Os x8 bank devices. This synchronous device achieves high-speed double-data-rate transfer rates of up to 1866Mb/sec/pin for general applications. The chip is designed to comply with all key DDR3L DRAM key features and all of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with differential DQS pairs in a source-synchronous fashion.

• JEDEC standard compliant, supports JEDEC clock jitter specification
• Power supplies: VDD and VDDQ=1.35V (1.283 to 1.45V), backward compatible to VDD and VDDQ=1.50.075V
• Fully synchronous operation, differential clock, CK and CK#
• Bidirectional differential data strobe, DQS & DQS#
• 8 internal banks for concurrent operation, 8n-bit prefetch architecture
• Pipelined internal architecture, precharge and active power down
• Programmable burst lengths: 4, 8, burst type: sequential/interleave
• Output driver impedance control, write levelling, ZQ calibration, auto refresh and self refresh
• Dynamic ODT (Rtt-Nom and Rtt-WR), 933MHz maximum clock
• 96-ball FBGA package, commercial temperature range from 0C to 95C

Product details

Technical Specifications

DRAM Type

DDR3

Memory Configuration

256M x 16bit

IC Case / Package

FBGA

Supply Voltage Nom

1.35V

Operating Temperature Min

0C

Product Range

–

SVHC

No SVHC (27-Jun-2024)

Memory Density

4Gbit

Clock Frequency Max

933MHz

No. of Pins

96Pins

IC Mounting

Surface Mount

Operating Temperature Max

95C

MSL

MSL 3 – 168 hours

Other details

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